Rigid-Flex Boards

Specifications

  • 2 – 20 Layers
  • Minimum Trace Width and Space: 0.050mm (2mil)
  • Minimum Hole Diameter: 0.10mm (4mil)
  • Minimum Total Thickness: 70 μm

Soldermask

  • Smallest Print Width 3mil; 
  • Alignment Tolerance ± 2mil

Dimension Tolerance

  • Hole DIA (D) : ± 0.025mm (with PTH ± 0.05mm)
  • Outline Dimension (L) : ± 0.05mm (by Hard Die Tool)
  • Pitch (P) : ± 0.1mm
  • Conductor Width (W) : ± 10% - ± 15%

Registration Tolerance

  • Coverlay Alignment : ± 8mil (0.2mm)
  • Adhesive Alignment : ± 12mil (0.3mm)
  • Stiffener Alignment : ± 12mil (0.3mm)
  • Impedance : Ω ± 5%

Surface Finish

  • Electroless Nickel / Immersion Gold (ENIG)
  • Electrolytic & Electroless Soft (Bondable) Gold
  • Immersion Silver
  • Immersion Tin
  • ENEPIG
  • ENTEK

Fabrication

  • Punch; Laser 
  • Ceramic Board
  • 1- 2 layers 
  • HDI Board
  • 1- 20 layers
  • Type 1 & 2 (Subcomposite Via & Interstitial Via Hole)
  • Dielectric Thickness 0.003"
  • Blind Via Aspect Ratio 1:1
  • Core Thickness 0.004"
  • Blind Via Laser Drill Diameter 0.004"
  • Blind Via Mechanical Drill Diameter 0.006"
  • Blind Via Plating Thickness 0.006"
  • Mechanical Drill Target Pad Diameter H+0.009"
  • Laser Drill Target Pad Diameter H+0.007"
  • Surface Micro-Via
  • Via-In Pad; 
  • Tented Via (Via Protection) 
  • Conductive / Non-Conductive Hole Fill; 
  • Blind/Buried Micro-Via

4 Layers Rigid-Flex

An example of stackup:

  • Soldermask
  • Copper
  • FR4
  • Adhesive
  • Polyimide
  • Adhesive
  • Copper
  • Adhesive
  • Polyimide
  • Adhesive
  • Copper
  • Adhesive
  • Polyimide
  • Adhesive
  • FR4
  • Copper
  • Soldermask