Rigid-Flex Boards
Specifications
- 2 – 20 Layers
- Minimum Trace Width and Space: 0.050mm (2mil)
- Minimum Hole Diameter: 0.10mm (4mil)
- Minimum Total Thickness: 70 μm
Soldermask
- Smallest Print Width 3mil;
- Alignment Tolerance ± 2mil
Dimension Tolerance
- Hole DIA (D) : ± 0.025mm (with PTH ± 0.05mm)
- Outline Dimension (L) : ± 0.05mm (by Hard Die Tool)
- Pitch (P) : ± 0.1mm
- Conductor Width (W) : ± 10% - ± 15%
Registration Tolerance
- Coverlay Alignment : ± 8mil (0.2mm)
- Adhesive Alignment : ± 12mil (0.3mm)
- Stiffener Alignment : ± 12mil (0.3mm)
- Impedance : Ω ± 5%
Surface Finish
- Electroless Nickel / Immersion Gold (ENIG)
- Electrolytic & Electroless Soft (Bondable) Gold
- Immersion Silver
- Immersion Tin
- ENEPIG
- ENTEK
Fabrication
- Punch; Laser
- Ceramic Board
- 1- 2 layers
- HDI Board
- 1- 20 layers
- Type 1 & 2 (Subcomposite Via & Interstitial Via Hole)
- Dielectric Thickness 0.003"
- Blind Via Aspect Ratio 1:1
- Core Thickness 0.004"
- Blind Via Laser Drill Diameter 0.004"
- Blind Via Mechanical Drill Diameter 0.006"
- Blind Via Plating Thickness 0.006"
- Mechanical Drill Target Pad Diameter H+0.009"
- Laser Drill Target Pad Diameter H+0.007"
- Surface Micro-Via
- Via-In Pad;
- Tented Via (Via Protection)
- Conductive / Non-Conductive Hole Fill;
- Blind/Buried Micro-Via
4 Layers Rigid-Flex
An example of stackup:
- Soldermask
- Copper
- FR4
- Adhesive
- Polyimide
- Adhesive
- Copper
- Adhesive
- Polyimide
- Adhesive
- Copper
- Adhesive
- Polyimide
- Adhesive
- FR4
- Copper
- Soldermask