Flex Boards
Specifications
- 1 - 16 Layers
- Minimum Trace Width and Space: 0.050mm (2mil)
- Minimum Hole Diameter: 0.10mm (4mil)
- Blind / Buried Micro-Via: 4mil
- Aspect Ratio: 16:1
- Overall size: 42"
- Maximum Total Thickness: 0.412 inches
Soldermask
- Smallest Print Width 3mil;
- Alignment Tolerance ± 2mil
Dimension Tolerance
- Hole DIA (D) : ± 0.025mm (with PTH ± 0.05mm)
- Outline Dimension (L) : ± 0.05mm (by Hard Die Tool)
- Pitch (P) : ± 0.1mm
- Conductor Width (W) : ± 10% - ± 15%
Registration Tolerance
- Coverlay Alignment : ± 8mil (0.2mm)
- Adhesive Alignment : ± 12mil (0.3mm)
- Stiffener Alignment : ± 12mil (0.3mm)
- Impedance : Ω ± 5%
Surface Finish
- Electroless Nickel / Immersion Gold (ENIG)
- Electrolytic & Electroless Soft (Bondable) Gold
- Immersion Silver
- Immersion Tin
- ENEPIG
- ENTEK
- Hot Air Solder Level
Fabrication
- N/C Routing; V-Scoring
Material
- FR4 (Tg 130~170℃)
- FR5(Tg 170~180℃)
- ROGERS,
- ARLON,
- ISLOA,
- NELCO,
- DUPONT,
- BT MATEIRAL,
- HALOGEN FREE MATERIAL
6 Layers Flex
An example of stackup:
- Polyimide
- Adhesive
- Copper
- Adhesive
- Polyimide
- Adhesive
- Copper
- Bondply
- Copper
- Adhesive
- Polyimide
- Adhesive
- Copper
- Bondply
- Copper
- Adhesive
- Polyimide
- Adhesive
- Copper
- Adhesive
- Polyimide