Flex Boards

Specifications

  • 1 - 16 Layers
  • Minimum Trace Width and Space: 0.050mm (2mil)
  • Minimum Hole Diameter: 0.10mm (4mil)
  • Blind / Buried Micro-Via: 4mil
  • Aspect Ratio: 16:1
  • Overall size: 42"
  • Maximum Total Thickness: 0.412 inches

Soldermask

  • Smallest Print Width 3mil; 
  • Alignment Tolerance ± 2mil

Dimension Tolerance

  • Hole DIA (D) : ± 0.025mm (with PTH ± 0.05mm)
  • Outline Dimension (L) : ± 0.05mm (by Hard Die Tool)
  • Pitch (P) : ± 0.1mm
  • Conductor Width (W) : ± 10% - ± 15%

Registration Tolerance

  • Coverlay Alignment : ± 8mil (0.2mm)
  • Adhesive Alignment : ± 12mil (0.3mm)
  • Stiffener Alignment : ± 12mil (0.3mm)
  • Impedance : Ω ± 5%

Surface Finish

  • Electroless Nickel / Immersion Gold (ENIG)
  • Electrolytic & Electroless Soft (Bondable) Gold
  • Immersion Silver
  • Immersion Tin
  • ENEPIG
  • ENTEK
  • Hot Air Solder Level

Fabrication

  • Punch
  • Laser cutout
  • Routing 

Material

  • FR4 (Tg 130~170℃)
  • FR5(Tg 170~180℃) 
  • ROGERS, 
  • ARLON, 
  • ISLOA, 
  • NELCO, 
  • DUPONT, 
  • BT MATEIRAL, 
  • HALOGEN FREE MATERIAL

Stackup examples:

 2 Layer Flex

4 Layers Flex

6 Layers Flex